MediaTek has launched its T930 chipset, a third-generation 5G platform delivering up to 10Gbps speeds and cutting-edge AI processing for FWA and Mi-Fi devices. Designed with power efficiency and spectrum innovation in mind, the T930 sets a new benchmark for next-gen wireless connectivity.
MALAYSIA, 16 MAY 2025 – MediaTek today announced the launch of its latest 5G chipset, the T930, designed for Fixed Wireless Access (FWA) and mobile Wi-Fi (Mi-Fi) devices. As a third-generation platform, the T930 further cements MediaTek’s leadership in the wireless communications industry by incorporating the most advanced wireless technologies available.
Built on an ultra-efficient 4nm architecture, the MediaTek T930 supports sub-6GHz frequencies and delivers blazing-fast 5G connection speeds of up to 10Gbps. It boasts several industry-first innovations, including 6CC-CA downlink and 5-layer 3Tx uplink, enabling data transmission speeds of up to 2.8Gbps.
Another standout feature is its support for 8Rx and 200MHz downlink bandwidth, enhancing spectrum efficiency by 40% and extending signal coverage by an equal margin—critical advantages for edge-of-cell performance. The chipset is fully compliant with the 3GPP Release-18 standard and includes advanced modem enhancements such as 3Tx and Low Latency, Low Loss, Scalable throughput (L4S) support.
At its core, the T930 integrates MediaTek’s new M90 5G modem, a quad-core Arm Cortex-A55 CPU, and a dedicated network processor, ensuring seamless 5G to Wi-Fi/Ethernet performance. The platform also includes an RF transceiver, GNSS receiver, and comprehensive power management tools.
The T930 can also pair with a dedicated NPU chip to transform into a generative AI gateway device—capable of performing advanced Edge AI tasks and interacting intelligently with connected devices. MediaTek’s Edge AI capabilities have already garnered attention at recent industry events and demonstrate the company’s forward-thinking vision.
“With mobile data growth and AI driving new user experiences, the T930 is poised to become the backbone of next-gen devices and services,” said JC Hsu, Corporate Senior Vice President of MediaTek. “It offers ultra-low latency, high performance, and always-available connectivity for an AI-enhanced future.”
MediaTek is actively collaborating with international partners to integrate the T930 into future FWA and Mi-Fi products, reinforcing its status as a trusted technology leader in the global market.
