MediaTek has introduced the Dimensity 9400+, a flagship SoC packed with cutting-edge AI capabilities and gaming features, promising power-efficient performance and next-gen mobile experiences. The first smartphones featuring the chipset will hit the market this month.
MALAYSIA, 12 APRIL 2025 – MediaTek has unveiled the Dimensity 9400+, the latest addition to its Dimensity flagship chipset lineup. This powerful new SoC is built to support next-generation on-device AI experiences while boosting overall performance and power efficiency for premium Android smartphones.
The Dimensity 9400+ is engineered with an All Big Core architecture, featuring one Arm Cortex-X925 core running up to 3.73GHz, along with three Cortex-X4 and four Cortex-A720 cores. This configuration delivers superior single- and multithreaded performance for smooth and responsive user experiences.
Equipped with the MediaTek NPU 890, the chipset enables support for various Large Language Models (LLMs) globally. It incorporates advanced AI capabilities such as Mixture-of-Experts (MoE), Multi-Head Latent Attention (MLA), Multi-Token Prediction (MTP), and FP8 inferencing for faster reasoning. With a 20% boost in agentic AI performance through Speculative Decoding+ (SpD+), and the inclusion of the Dimensity Agentic AI Engine (DAE), the 9400+ makes it easier for developers to build sophisticated AI-powered applications.
Gaming performance is elevated with a 12-core Arm Immortalis-G925 GPU that introduces PC-level graphical features to smartphones. Support for opacity micromap (OMM) technology enhances realism in visual elements like hair, vegetation, and feathers, all while preserving performance. The chipset also integrates the MediaTek Frame Rate Converter 2.0+ (MFRC 2.0+), which improves gameplay smoothness by doubling effective frame rates and increasing power efficiency by up to 40%.
The MediaTek Imagiq 1090 image signal processor enables HDR video recording across the full zoom range. Smooth Zoom technology enhances mobile videography by offering fluid tracking of moving subjects and improved control over image and audio focus.
Additional standout features of the Dimensity 9400+ include:
- Extended Bluetooth direct connection range of up to 10km, a 6.6-fold increase over the previous generation
- BeiDou satellite support with 33% faster Time to First Fix (TTFF) even without cellular networks
- Tri-band Wi-Fi 7 with five-stream concurrency and MediaTek Xtra Range™ 3.0, extending coverage by up to 30 meters
- 5G/4G Dual SIM Dual Active functionality with dual data capability
Smartphones powered by the Dimensity 9400+ are expected to be available starting this month.
For more information, visit MediaTek’s official Dimensity portfolio page at https://i.mediatek.com/mediatek-5g.
